FolDTronics Demo: Creating 3D objects with integrated electronics using foldable honeycomb structures
Name
2019-CHI-FoldTronics-paper.pdf
Description
Accepted version
Size
8 MB
Format
Adobe PDF
Checksum (MD5)
387b96468b9b93a1684c9d5d786e9044
Author(s)
Yamaoka, Junichi
Dogan, Mustafa Doga
Bulovic, Katarina M.
Kawahara, Yoshihiro
Kakehi, Yasuaki
Mueller, Stefanie
Date Issued
May 2019
Journal
Proceedings of CHI ’19
Publisher
Association for Computing Machinery
Citation
Yamaoka, Junichi, Mustafa Doga Dogan, Katarina Bulovic, Kazuya Saito, Yoshihiro Kawahara, Yasuaki Kakehi and Stefanie Mueller. "FolDTronics Demo: Creating 3D objects with integrated electronics using foldable honeycomb structures." In Proceedings of CHI ’19, May 4–9, 2019, Glasgow, Scotland UK.
Version
Author's final manuscript
Abstract
We present FoldTronics, a 2D-cutting based fabrication technique to integrate electronics into 3D folded objects. The key idea is to cut and perforate a 2D sheet to make it foldable into a honeycomb structure using a cutting plotter; before folding the sheet into a 3D structure, users place the electronic components and circuitry onto the sheet. The fabrication process only takes a few minutes enabling users to rapidly prototype functional interactive devices. The resulting objects are lightweight and rigid, thus allowing for weight-sensitive and force-sensitive applications. Finally, due to the nature of the honeycomb structure, the objects can be folded flat along one axis and thus can be efficiently transported in this compact form factor. We describe the structure of the foldable sheet, and present a design tool that enables users to quickly prototype the desired objects. We showcase a range of examples made with our design tool, including objects with integrated sensors and display elements.
MIT Department
Massachusetts Institute of Technology. Computer Science and Artificial Intelligence Laboratory
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
Program in Media Arts and Sciences (Massachusetts Institute of Technology)
Terms of Use
Creative Commons Attribution-Noncommercial-Share Alike
Persistent DSpace Link
DOI of Published Version
https://doi.org/10.1145/3290607.3313242
