Effect of microstructure of aluminum alloys on the electromigration-limited reliability of VLSI interconnects
Name
24250277-MIT.pdf
Description
Full printable version
Size
12.61 MB
Format
Adobe PDF
Checksum (MD5)
df932c901aa33e04d6b5a4ae62856361
Author(s)
Cho, Jaeshin
Advisor(s)
Carl V. Thompson.
Date Issued
1990
Publisher
Massachusetts Institute of Technology
Description
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1990.
Includes bibliographical references (leaves 210-222).
Subjects
Materials Science and Engineering
MIT Department
Massachusetts Institute of Technology. Department of Materials Science and Engineering
Terms of Use
M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.
Persistent DSpace Link
