Characterization and Modeling of Stress Evolution During Nickel Silicides Formation
Name
AMMNS003.pdf
Size
370.61 KB
Format
Adobe PDF
Checksum (MD5)
b55a9193b742084b2c0d86d962d48360
Author(s)
Liew, K.P.
Li, Yi
Yeadon, Mark
Bernstein, R.
Thompson, Carl V.
Date Issued
January 2003
Series/Report no.
Advanced Materials for Micro- and Nano-Systems (AMMNS);
Abstract
An curvature measurement technique was used to characterize the stress evolution during reaction of a Ni film and a silicon substrate to form nickel silicide. Stress changes were measured at each stage of the silicide growth. When the nickel films were subjected to long-time isothermal annealing, stresses that developed during silicide formation gradually relaxed. Fitting the experimental results with a kinetic model provides insight into the volumetric strain and relaxation behavior of the reacting film and the reaction product.
Subjects
nickel silicide
stress evolution
Coble creep
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