Plasma polymerization of C[subscript 4]F[subscript 8] thin film on high aspect ratio silicon molds
Name
IMST023.pdf
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664.06 KB
Format
Adobe PDF
Checksum (MD5)
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Author(s)
Yeo, L. P.
Poh, S. L.
Lam, Yee Cheong
Chan-Park, Mary Bee-Eng
Alternative Title
Plasma polymerization of C4F8 thin film on high aspect ratio silicon molds
Date Issued
January 2005
Series/Report no.
Innovation in Manufacturing Systems and Technology (IMST);
Abstract
High aspect ratio polymeric micro-patterns are ubiquitous in many fields ranging from sensors, actuators, optics, fluidics and medical. Second generation PDMS molds are replicated against first generation silicon molds created by deep reactive ion etching. In order to ensure successful demolding, the silicon molds are coated with a thin layer of C[subscript 4]F[subscript 8] plasma polymer to reduce the adhesion force. Peel force and demolding status are used to determine if delamination is successful. Response surface method is employed to provide insights on how changes in coil power, passivating time and gas flow conditions affect plasma polymerization of C[subscript 4]F[subscript 8].
Subjects
C4F8
plasma polymerization
peel force
demolding
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