Plug-and-play microvalve and micropump for rapid integration with microfluidic chips
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Author(s)
Mousavi Shaegh, Seyed Ali
Wang, Zhenfeng
Ng, Sum Huan
Wu, Ruige
Nguyen, Huu Tuan
Chan, Leon Cong Zhi
Toh, Alicia Guek Geok
Wang, Zhiping
Date Issued
April 2015
Journal
Microfluidics and Nanofluidics
Publisher
Springer Berlin Heidelberg
Citation
Shaegh, Seyed Ali Mousavi, Zhenfeng Wang, Sum Huan Ng, Ruige Wu, Huu Tuan Nguyen, Leon Cong Zhi Chan, Alicia Guek Geok Toh, and Zhiping Wang. “Plug-and-Play Microvalve and Micropump for Rapid Integration with Microfluidic Chips.” Microfluid Nanofluid 19, no. 3 (April 22, 2015): 557–564.
Version
Author's final manuscript
Abstract
This paper reports design, fabrication, and characterization of an air-actuated microvalve and a micropump made of thermoplastic materials. The bonding process was carried out by thermal fusion process with no particular surface treatment. The developed microvalve was used as a reversible switch for controlling both liquid flow and electrical field. Bonding strength of the fabricated microvalves could withstand liquid and air pressures of up to 600 kPa with no burst failure. The micropump made of three connected microvalves, actuated by compressed air, could generate a liquid flow rate of up to 85 µl/min. The proposed microvalve and micropump can be used as pre-fabricated off-the-shelf microfluidic functional elements for easy and rapid integration with thermoplastic microfluidic circuitries in a plug-and-play arrangement.
MIT Department
Harvard University--MIT Division of Health Sciences and Technology
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Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.
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DOI of Published Version
https://doi.org/10.1007/s10404-015-1582-4
