Chromatic covalent organic frameworks enabling in-vivo chemical tomography
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s41467-024-53532-7.pdf
Description
Published version
Size
5.13 MB
Format
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Checksum (MD5)
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Author(s)
Wang, Song
Han, Yangyang
Reddy, Vaishnavi Amarr
Ang, Mervin Chun-Yi
Sánchez-Velázquez, Gabriel
Saju, Jolly Madathiparambil
Cao, Yunteng
Khong, Duc Thinh
Jayapal, Praveen Kumar
Cheerlavancha, Raju
Date Issued
October 28, 2024
Journal
Nature Communications
Publisher
Springer Science and Business Media LLC
Citation
Wang, S., Han, Y., Reddy, V.A. et al. Chromatic covalent organic frameworks enabling in-vivo chemical tomography. Nat Commun 15, 9300 (2024).
Version
Final published version
Abstract
Covalent organic frameworks designed as chromatic sensors offer opportunities to probe biological interfaces, particularly when combined with biocompatible matrices. Particularly compelling is the prospect of chemical tomography – or the 3D spatial mapping of chemical detail within the complex environment of living systems. Herein, we demonstrate a chromic Covalent Organic Framework (COF) integrated within silk fibroin (SF) microneedles that probe plant vasculature, sense the alkalization of vascular fluid as a biomarker for drought stress, and provide a 3D in-vivo mapping of chemical gradients using smartphone technology. A series of Schiff base COFs with tunable pKa ranging from 5.6 to 7.6 enable conical, optically transparent SF microneedles with COF coatings of 120 to 950 nm to probe vascular fluid and the surrounding tissues of tobacco and tomato plants. The conical design allows for 3D mapping of the chemical environment (such as pH) at standoff distances from the plant, enabling in-vivo chemical tomography. Chromatic COF sensors of this type will enable multidimensional chemical mapping of previously inaccessible and complex environments.
MIT Department
Singapore-MIT Alliance in Research and Technology (SMART)
Massachusetts Institute of Technology. Department of Chemical Engineering
Massachusetts Institute of Technology. Department of Civil and Environmental Engineering
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DOI of Published Version
10.1038/s41467-024-53532-7
