Computer Detection of Bent Fingers in Lead Bonding Frames
Name
AI_WP_117.pdf
Description
Main article
Size
1.38 MB
Format
Adobe PDF
Checksum (MD5)
ee73e1a36123b7c7f02b7a517fac5005
Author(s)
Mitnick, Walter L.
Date Issued
January 1976
Publisher
MIT Artificial Intelligence Laboratory
Series/Report no.
MIT Artificial Intelligence Laboratory Working Papers, WP-117;
Abstract
In the production of logic circuits in dual inline packages, various tedious assembly line tasks are performed by human operators using microscopes or television enlargements. One boring and difficult task is the detection of bent fingers in lead bonding frames to which integrated circuit chips are subsequently bonded. Bent fingers can cause stresses which may eventually lead to the failure of circuits. This paper discusses the inspection problem and presents a computerized bent finger detection method which could be adapted to free human operators from this task. More immediately, it presents a method of examining an object and determining whether or not it is in focus based solely on inspection of the object's digitized light intensity profiles.
Description
This report describes research done at the Artificial Intelligence Laboratory of the Massachusetts Institute of Technology. Support for the laboratory's artificial intelligence research is provided in part by the Advanced Research Projects Agency of the Department of Defense under Office of Naval Research contract N00014-75-C-0643.
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