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  4. Dense, low-power sensor network for three-dimensional thermal characterization of large-scale atria spaces

Dense, low-power sensor network for three-dimensional thermal characterization of large-scale atria spaces

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Author(s)
Gong, Nan-Wei
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Ray, Steve
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Ware, Gary
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Leida, Brett
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Ren, Tim
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London, Phil
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Paradiso, Joseph A.
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Ware, Laura M.
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Turza, Ashley K.
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Way, David H.
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Date Issued
October 2012
Journal
2012 IEEE Sensors
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Citation
Gong, Nan-Wei, Laura Ware, Steve Ray, Gary Ware, Brett Leida, Tim Ren, Phil London, et al. “Dense, low-power sensor network for three-dimensional thermal characterization of large-scale atria spaces.” In 2012 IEEE Sensors, 1-4. Institute of Electrical and Electronics Engineers, 2012.
Version
Author's final manuscript
Abstract
We describe the design and implementation of a dense, low-power wireless sensor network for fine-grained three-dimensional thermal characterization of a large open indoor space. To better understand the airflow dynamics and ensuing energy efficiency potential of this type of modern architectural design, we developed a sustainable wireless mesh network consisting of 50 sensors hung on an array of thin cables in a 210 m[superscript 2], 14.2 m tall atrium for real-time temperature and humidity monitoring. The goal is to create compact wireless measurement sensor blocks for dense coverage in the building. We demonstrate the implementation through a preliminary analysis, which includes the evaluation of temperature distribution discrepancies with computer-simulated results and data taken during natural ventilation to illustrate the nontrivial, well-mixed temperatures observed during the studies.
MIT Department
Massachusetts Institute of Technology. Department of Architecture
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
Massachusetts Institute of Technology. Department of Mechanical Engineering
Massachusetts Institute of Technology. Media Laboratory
Massachusetts Institute of Technology. Research Laboratory of Electronics
Terms of Use
Creative Commons Attribution-Noncommercial-Share Alike 3.0
http://creativecommons.org/licenses/by-nc-sa/3.0/
Persistent DSpace Link
http://hdl.handle.net/1721.1/80767
DOI of Published Version
https://doi.org/10.1109/ICSENS.2012.6411177
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