Simulation of the effect of microstructure on electromigration induced failure of interconnects
Name
37519913-MIT.pdf
Description
Full printable version
Size
4.84 MB
Format
Adobe PDF
Checksum (MD5)
9e40216ec99da9929e848952cfe7e2f1
Author(s)
Fayad, Walid R. (Walid Rahif)
Advisor(s)
Carl V. Thompson.
Date Issued
1997
Publisher
Massachusetts Institute of Technology
Description
Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Civil and Environmental Engineering, 1997.
Includes bibliographical references (leaves 85-87).
Subjects
Civil and Environmental Engineering
MIT Department
Massachusetts Institute of Technology. Department of Civil and Environmental Engineering
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