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Measurement results for an x-ray 3D-integrated active pixel sensor

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Prigozhin-2010-Measurement results for an x-ray 3D-integrated active pixel sensor.pdf

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Author(s)
Prigozhin, Gregory
•
Foster, Richard F.
•
Suntharalingam, Vyshnavi
•
Kissel, Steve E.
•
La Marr, Beverly J.
•
Bautz, Marshall W.
Date Issued
July 2010
Journal
Proceedings of SPIE--the International Society for Optical Engineering
Publisher
SPIE
Citation
G. Prigozhin, R. Foster, V. Suntharalingam, S. Kissel, B. LaMarr and M. Bautz, "Measurement results for an x-ray 3D-integrated active pixel sensor", Proc. SPIE 7742, 77421I (2010); doi:10.1117/12.857652 © 2010 COPYRIGHT SPIE
Version
Final published version
Abstract
We have developed a hybrid Active Pixel Sensor for detecting low energy X-rays. The sensor consists of a silicon diode detector array built on a high resistivity wafer and an SOI CMOS readout circuit, connected together by means of unique 3D integration technology developed at MIT Lincoln Laboratory. In this paper we will describe measurements of sense node capacitance and device depletion depth along with corresponding simulations aimed to optimize device performance. We also describe race condition in the column decoder and identify ways to eliminate it in order to reduce fixed pattern noise.
MIT Department
Lincoln Laboratory
MIT Kavli Institute for Astrophysics and Space Research
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Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.
Persistent DSpace Link
http://hdl.handle.net/1721.1/60939
DOI of Published Version
http://dx.doi.org/10.1117/12.857652
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