Effective modeling of throughput time in semiconductor assembly processes
Name
42251037-MIT.pdf
Description
Full printable version
Size
6.88 MB
Format
Adobe PDF
Checksum (MD5)
028c4e3645eceb4036a4bb313357ef9c
Author(s)
Cervantes José A. (José Armando), 1973-
Advisor(s)
Kevin Otto and Stanley B. Gershwin.
Date Issued
1998
Publisher
Massachusetts Institute of Technology
Abstract
We develop discrete event simulation (DES) models of a semiconductor assembly process capable of predicting average throughput time (TPT) within 6% of factory-floor measured average TPT. This represents a significant improvement over current DES models in the semiconductor industry, which commonly yield average TPTs that are 25% to 50% less than those measured on the factory floor. We accomplish this improvement by (1) constructing a separate area model of the system's constraint, (2) inputting an exact lot-starts schedule to the model, and (3) using failure parameters which are operation dependent rather than time dependent. In addition, we devise heuristics to parallelize the simulation process and significantly reduce computational expense in DES models, thereby affording the inclusion of detailed factors. We perform various sensitivity studies on the assembly's constraining process which indicate that operators and shift effects do not have a significant effect on average TPT. We also apply the series-parallel flow-line analytical model developed by Gershwin [8] and Burman [2], obtaining average TPTs which are 27% of factory-floor measured average TPT with numerical computational times of under a second.
Description
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering; and, (S.M.)--Massachusetts Institute of Technology, Sloan School of Management, 1998.
Includes bibliographical references (p. 155-156).
Subjects
Mechanical Engineering
Sloan School of Management
MIT Department
Massachusetts Institute of Technology. Department of Mechanical Engineering
Sloan School of Management
Terms of Use
M.I.T. theses are protected by
copyright. They may be viewed from this source for any purpose, but
reproduction or distribution in any format is prohibited without written
permission. See provided URL for inquiries about permission.
copyright. They may be viewed from this source for any purpose, but
reproduction or distribution in any format is prohibited without written
permission. See provided URL for inquiries about permission.
Persistent DSpace Link
