Heat Transfer in Thermoelectric Materials and Devices
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HT_2013.pdf
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352.45 KB
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Author(s)
Tian, Zhiting
Lee, Sangyeop
Chen, Gang
Date Issued
May 2013
Journal
Journal of Heat Transfer
Publisher
ASME International
Citation
Tian, Zhiting, Sangyeop Lee, and Gang Chen. “Heat Transfer in Thermoelectric Materials and Devices.” Journal of Heat Transfer 135, no. 6 (June 1, 2013): 061605. Copyright © 2013 by ASME
Version
Final published version
Abstract
Solid-state thermoelectric devices are currently used in applications ranging from thermocouple sensors to power generators in space missions, to portable air-conditioners and refrigerators. With the ever-rising demand throughout the world for energy consumption and CO[subscript 2] reduction, thermoelectric energy conversion has been receiving intensified attention as a potential candidate for waste-heat harvesting as well as for power generation from renewable sources. Efficient thermoelectric energy conversion critically depends on the performance of thermoelectric materials and devices. In this review, we discuss heat transfer in thermoelectric materials and devices, especially phonon engineering to reduce the lattice thermal conductivity of thermoelectric materials, which requires a fundamental understanding of nanoscale heat conduction physics.
MIT Department
Massachusetts Institute of Technology. Department of Mechanical Engineering
Terms of Use
Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.
Persistent DSpace Link
DOI of Published Version
https://doi.org/10.1115/1.4023585
