COMPREHENSIVE REVIEW OF HEAT TRANSFER IN THERMOELECTRIC MATERIALS AND DEVICES
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1401.0749.pdf
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1.51 MB
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Author(s)
Tian, Zhiting
Lee, Sangyeop
Chen, Gang
Date Issued
January 2014
Journal
Annual Review of Heat Transfer
Publisher
Begell House
Citation
Tian, Zhiting, Sangyeop Lee, and Gang Chen. “COMPREHENSIVE REVIEW OF HEAT TRANSFER IN THERMOELECTRIC MATERIALS AND DEVICES.” Annual Review of Heat Transfer 17, no. N/A (2014): 425–483.
Version
Author's final manuscript
Abstract
Solid-state thermoelectric devices are currently used in applications ranging from thermocouple sensors to power generators in satellites, to portable air-conditioners and refrigerators. With the ever-rising demand throughout the world for energy consumption and CO₂ reduction, thermoelectric energy conversion has been receiving intensified attention as a potential candidate for waste- heat harvesting as well as for power generation from renewable sources. Efficient thermoelectric energy con version critically depends on the performance of thermoelectric materials and devices. In this review, we discuss heat transfer in thermoelectric materials and devices, especially phonon engineering to reduce the lattice thermal conductivity of thermoelec tric materials, which requires a fundamental understanding of nanoscale heat conduction physics.
MIT Department
Massachusetts Institute of Technology. Department of Mechanical Engineering
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Creative Commons Attribution-Noncommercial-Share Alike
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DOI of Published Version
https://doi.org/10.1615/ANNUALREVHEATTRANSFER.2014006932
