Digital-pixel focal plane array development
Name
Brown-2010-Digital-pixel focal.pdf
Size
3.13 MB
Format
Adobe PDF
Checksum (MD5)
73734eec6d800c9c49c75f6cd79e1126
Author(s)
Brown, Matthew G.
Baker, Justin J.
Colonero, Curtis B.
Costa, Joseph S.
Gardner, Thomas D.
Kelly, Michael W.
Schultz, Kenneth I.
Tyrrell, Brian M.
Wey, James R.
Date Issued
January 2010
Journal
Quantum Sensing and Nanophotonic Devices VII
Publisher
Society of Photo-optical Instrumentation Engineers
Citation
Brown, Matthew G. et al. “Digital-pixel focal plane array development.” Quantum Sensing and Nanophotonic Devices VII. Ed. Manijeh Razeghi, Rengarajan Sudharsanan, & Gail J. Brown. San Francisco, California, USA: SPIE, 2010. 76082H-10. ©2010 SPIE--The International Society for Optical Engineering.
Version
Final published version
Abstract
Since 2006, MIT Lincoln Laboratory has been developing Digital-pixel Focal Plane Array (DFPA) readout integrated circuits (ROICs). To date, four 256 × 256 30 µm pitch DFPA designs with in-pixel analog to digital conversion have been fabricated using IBM 90 nm CMOS processes. The DFPA ROICs are compatible with a wide range of detector materials and cutoff wavelengths; HgCdTe, QWIP, and InGaAs photo-detectors with cutoff wavelengths ranging from 1.6 to 14.5 µm have been hybridized to the same digital-pixel readout. The digital-pixel readout architecture offers high dynamic range, A/C or D/C coupled integration, and on-chip image processing with low power orthogonal transfer operations. The newest ROIC designs support two-color operation with a single Indium bump connection. Development and characterization of the two-color DFPA designs is presented along with applications for this new digital readout technology.
MIT Department
Lincoln Laboratory
Terms of Use
Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.
Persistent DSpace Link
DOI of Published Version
https://doi.org/10.1117/12.838314
