Electrowetting-on-Dielectric Actuation of a Vertical Translation and Angular Manipulation Stage
Name
Electrowetting Stage Manuscript with Supporting Info.pdf
Description
Manuscript with Supporting Info
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879.41 KB
Format
Adobe PDF
Checksum (MD5)
87db5d80c01a54f98ea06fea89b4a469
Author(s) • • • • • •
Wang, Evelyn
Preston, Daniel John
Anders, Ariel S
Barabadi, Banafsheh
Tio, Evelyn
Zhu, Yangying
Dai, DingRan
Date Issued
December 2016
Journal
Applied Physics Letters
Publisher
American Institute of Physics (AIP)
Citation
Preston, Daniel J. et al. “Electrowetting-on-Dielectric Actuation of a Vertical Translation and Angular Manipulation Stage.” Applied Physics Letters 109.24 (2016): 244102.
Version
Author's final manuscript
Abstract
Adhesion and friction during physical contact of solid components in microelectromechanical systems (MEMS) often lead to device failure. Translational stages that are fabricated with traditional silicon MEMS typically face these tribological concerns. This work addresses these concerns by developing a MEMS vertical translation, or focusing, stage that uses electrowetting-on-dielectric (EWOD) as the actuating mechanism. EWOD has the potential to eliminate solid-solid contact by actuating through deformation of liquid droplets placed between the stage and base to achieve stage displacement. Our EWOD stage is capable of linear spatial manipulation with resolution of 10 μm over a maximum range of 130 μm and angular deflection of approximately ±1°, comparable to piezoelectric actuators. We also developed a model that suggests a higher intrinsic contact angle on the EWOD surface can further improve the translational range, which was validated experimentally by comparing different surface coatings. The capability to operate the stage without solid-solid contact offers potential improvements for applications in micro-optics, actuators, and other MEMS devices.
MIT Department
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
Massachusetts Institute of Technology. Department of Mechanical Engineering
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Creative Commons Attribution-Noncommercial-Share Alike
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DOI of Published Version
https://doi.org/10.1063/1.4971777