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  5. Orienting Silicon Integrated Circuit Chips for Lead Bonding

Orienting Silicon Integrated Circuit Chips for Lead Bonding

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Author(s)
Horn, Berthold K.P.
Date Issued
January 1, 1975
Series/Report no.
AIM-323
Abstract
Will computers that see and understand what they see revolutionize industry by automating the part orientation and part inspection processes? There are two obstacles: the expense of computin and our feeble understanding of images. We believe these obstacles are fast ending. To illustrate what can be done we describe a working program that visually determines the position and orientation of silicon chips used in integrated circuits.
Persistent DSpace Link
http://hdl.handle.net/1721.1/5799
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