Coarsening and solidification via solvent-annealing in thin liquid films
Name
Bulovic_Coarsening and.pdf
Size
1.33 MB
Format
Adobe PDF
Checksum (MD5)
752225c5618009c5b047f7903273abd7
Author(s) • •
Yu, Tony S.
Bulovic, Vladimir
Hosoi, Anette E.
Date Issued
April 2013
Journal
Journal of Fluid Mechanics
Publisher
Cambridge University Press
Citation
Yu, Tony S., Vladimir Bulović, and A. E. Hosoi. “Coarsening and Solidification via Solvent-Annealing in Thin Liquid Films.” J. Fluid Mech. 723 (May 2013): 69–90. © Cambridge University Press 2013.
Version
Final published version
Abstract
We examine solidification in thin liquid films produced by annealing amorphous Alq[subscript 3] (tris-(8-hydroxyquinoline) aluminium) in methanol vapour. Micrographs acquired during annealing capture the evolution of the film: the initially-uniform film breaks up into drops that coarsen, and single crystals of Alq[subscript 3] nucleate randomly on the substrate and grow as slender ‘needles’. The growth of these needles appears to follow power-law behaviour, where the growth exponent, γ, depends on the thickness of the deposited Alq[subscript 3] film. The evolution of the thin film is modelled by a lubrication equation, and an advection–diffusion equation captures the transport of Alq[subscript 3] and methanol within the film. We define a dimensionless transport parameter, α, which is analogous to an inverse Sherwood number and quantifies the relative effects of diffusion- and coarsening-driven advection. For large α-values, the model recovers the theory of one-dimensional, diffusion-driven solidification, such that γ→1/2. For low α-values, the collapse of drops, i.e. coarsening, drives flow and regulates the growth of needles. Within this regime, we identify two relevant limits: needles that are small compared to the typical drop size, and those that are large. Both scaling analysis and simulations of the full model reveal that γ→2/5 for small needles and γ→0.29 for large needles.
MIT Department
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
Terms of Use
Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.
Persistent DSpace Link
DOI of Published Version
https://doi.org/10.1017/jfm.2013.115