Integrated silicon pressure sensors using wafer bonding technology
Name
37650031-MIT.pdf
Description
Full printable version
Size
15.24 MB
Format
Adobe PDF
Checksum (MD5)
885b7b89757cdc4800c9cf7a2eedffaf
Author(s)
Parameswaran, Lalitha
Advisor(s)
Martin A. Schmidt.
Date Issued
1997
Publisher
Massachusetts Institute of Technology
Description
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1997.
Includes bibliographical references (p. 151-156).
Subjects
Electrical Engineering and Computer Science
MIT Department
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
Terms of Use
M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.
Persistent DSpace Link
