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  5. A statistical metrology framework for characterizing ILD thickness variation in CMP processes

A statistical metrology framework for characterizing ILD thickness variation in CMP processes

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Author(s)
Chang, Eric Choong-Yin
Advisor(s)
James Chung, Duane Boning.
Alternative Title
Statistical metrology framework for characterizing inter-level dielectric thickness variation in chemical machine polishing.
Date Issued
1996
Publisher
Massachusetts Institute of Technology
Description
Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1996.
Includes bibliographical references (leaf 109).
Subjects
Electrical Engineering and Computer Science
MIT Department
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
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http://dspace.mit.edu/handle/1721.1/7582
Persistent DSpace Link
http://hdl.handle.net/1721.1/41383
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