3D integrated superconducting qubits
Name
s41534-017-0044-0.pdf
Description
Published version
Size
823.38 KB
Format
Adobe PDF
Checksum (MD5)
04d1dc65e9fc776221d8d5449dd77bf4
Author(s)
Rosenberg, D
Kim, D
Das, R
Yost, D
Gustavsson, S
Hover, D
Krantz, P
Melville, A
Racz, L
Samach, GO
Date Issued
2017
Journal
npj Quantum Information
Publisher
Springer Nature America, Inc
Version
Final published version
Abstract
As the field of superconducting quantum computing advances from the few-qubit
stage to larger-scale processors, qubit addressability and extensibility will
necessitate the use of 3D integration and packaging. While 3D integration is
well-developed for commercial electronics, relatively little work has been
performed to determine its compatibility with high-coherence solid-state
qubits. Of particular concern, qubit coherence times can be suppressed by the
requisite processing steps and close proximity of another chip. In this work,
we use a flip-chip process to bond a chip with superconducting flux qubits to
another chip containing structures for qubit readout and control. We
demonstrate that high qubit coherence ($T_1$, $T_{2,\rm{echo}} > 20\,\mu$s) is
maintained in a flip-chip geometry in the presence of galvanic, capacitive, and
inductive coupling between the chips.
MIT Department
Lincoln Laboratory
Massachusetts Institute of Technology. Research Laboratory of Electronics
Massachusetts Institute of Technology. Department of Physics
Terms of Use
Creative Commons Attribution 4.0 International license
Persistent DSpace Link
DOI of Published Version
https://doi.org/10.1038/S41534-017-0044-0
