Mathematical and physical modeling of flip-chip soldering processes
Name
34148884-MIT.pdf
Description
Full printable version
Size
19.12 MB
Format
Adobe PDF
Checksum (MD5)
73d04a642a25593c9bb56856dcddecfa
Author(s)
Deering, Scott E. (Scott Earl), 1967-
Advisor(s)
Julian Szekely.
Date Issued
1995
Publisher
Massachusetts Institute of Technology
Description
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1995.
Includes bibliographical references (p. 312-314).
Subjects
Materials Science and Engineering
MIT Department
Massachusetts Institute of Technology. Department of Materials Science and Engineering
Terms of Use
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