An empirical study of manufacturing flexibility in printed-circuit board assembly
Name
JP-WP-92-11-27478826.pdf
Size
2.84 MB
Format
Adobe PDF
Checksum (MD5)
c69b18a5a9bfd90277ca6665b1f9527f
Date Issued
1992
Publisher
MIT Japan Program, Massachusetts Institute of Technology
Series/Report no.
MITJP (Series) ; 92-11.
Description
Includes bibliographical references (p. 19-21).
Persistent DSpace Link