An empirical study of manufacturing flexibility in printed-circuit board assembly

Name

JP-WP-92-11-27478826.pdf

Size

2.84 MB

Format

Adobe PDF

Checksum (MD5)

c69b18a5a9bfd90277ca6665b1f9527f

Date Issued

1992

Publisher

MIT Japan Program, Massachusetts Institute of Technology

Series/Report no.

MITJP (Series) ; 92-11.

Description

Includes bibliographical references (p. 19-21).

Persistent DSpace Link