Electromigration failure and reliability of single-crystal and polycyrstalline aluminum interconnects for integrated circuits
Name
33328012-MIT.pdf
Description
Full printable version
Size
12.05 MB
Format
Adobe PDF
Checksum (MD5)
666e371ad7d5cfd144fa2a7985c9f6c7
Author(s)
Joo, Young-Chang
Advisor(s)
Carl V. Thompson.
Date Issued
1995
Publisher
Massachusetts Institute of Technology
Description
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1995.
Includes bibliographical references (leaves 206-216).
Subjects
Materials Science and Engineering
MIT Department
Massachusetts Institute of Technology. Department of Materials Science and Engineering
Terms of Use
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