Liquid embossing : a technique for fabricating sub-micron electrical, mechanical and biological structures
Name
51111279-MIT.pdf
Description
Full printable version
Size
22.92 MB
Format
Adobe PDF
Checksum (MD5)
4ec0308d5b0fe81673045395f8e9517f
Author(s)
Bulthaup, Colin A. (Colin Aaron), 1976-
Advisor(s)
Joseph M. Jacobson.
Alternative Title
Fabricating sub-micron electrical, mechanical and biological structures
Date Issued
2001
Publisher
Massachusetts Institute of Technology
Description
Thesis (M.Eng. and S.B.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2001.
Includes bibliographical references (leaf 92).
Subjects
Electrical Engineering and Computer Science.
MIT Department
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
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copyright. They may be viewed from this source for any purpose, but
reproduction or distribution in any format is prohibited without written
permission. See provided URL for inquiries about permission.
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