Thermal and Optical Characterization of Photonic Integrated Circuits by Thermoreflectance Microscopy
Name
Summers-2010-Thermal and Optical.pdf
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1.07 MB
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Author(s)
Summers, Joseph A.
Farzaneh, Maryam
Ram, Rajeev J.
Hudgings, Janice A.
Date Issued
January 2010
Journal
IEEE Journal of Quantum Electronics
Publisher
Institute of Electrical and Electronics Engineers
Citation
Summers, J.A. et al. “Thermal and Optical Characterization of Photonic Integrated Circuits by Thermoreflectance Microscopy.” Quantum Electronics, IEEE Journal of 46.1 (2010): 3-10. © 2009 Institute of Electrical and Electronics Engineers.
Version
Final published version
Abstract
We report high resolution, non-invasive, thermal and optical characterization of semiconductor optical amplifiers (SOAs) and SOA-based photonic integrated circuits (PICs) using thermoreflectance microscopy. Chip-scale temperature imaging of SOAs and PICs, along with an energy balance model, are used to calculate the optical power distribution within and between SOAs to determine optical gain, fiber coupling loss, and passive component loss under normal device operating conditions. This technique is demonstrated to map optical power in SOA-based Mach-Zehnder interferometer (SOA-MZI) PICs, with close agreement with photocurrent and fiber-coupled measurements. The use of amplified spontaneous emission (ASE) for fiber-free characterization of the PICs is also shown, enabling non-invasive, wafer-scale testing prior to packaging.
MIT Department
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
Massachusetts Institute of Technology. Research Laboratory of Electronics
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Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.
Persistent DSpace Link
DOI of Published Version
http://dx.doi.org/10.1109/jqe.2009.2022648
