Nanofabrication on unconventional substrates using transferred hard masks
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Li-2015-Nanofabrication.pdf
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Author(s)
Li, Luozhou
Bayn, Igal
Lu, Ming
Nam, Chang-Yong
Stein, Aaron
Schroder, Tim
Harris, Nicholas Christopher
Englund, Dirk Robert
Date Issued
January 2015
Journal
Scientific Reports
Publisher
Nature Publishing Group
Citation
Li, Luozhou, Igal Bayn, Ming Lu, Chang-Yong Nam, Tim Schroder, Aaron Stein, Nicholas C. Harris, and Dirk Englund. “Nanofabrication on Unconventional Substrates Using Transferred Hard Masks.” Sci. Rep. 5 (January 15, 2015): 7802.
Version
Final published version
Abstract
A major challenge in nanofabrication is to pattern unconventional substrates that cannot be processed for a variety of reasons, such as incompatibility with spin coating, electron beam lithography, optical lithography, or wet chemical steps. Here, we present a versatile nanofabrication method based on re-usable silicon membrane hard masks, patterned using standard lithography and mature silicon processing technology. These masks, transferred precisely onto targeted regions, can be in the millimetre scale. They allow for fabrication on a wide range of substrates, including rough, soft, and non-conductive materials, enabling feature linewidths down to 10 nm. Plasma etching, lift-off, and ion implantation are realized without the need for scanning electron/ion beam processing, UV exposure, or wet etching on target substrates.
MIT Department
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
Massachusetts Institute of Technology. Research Laboratory of Electronics
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Creative Commons Attribution
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DOI of Published Version
https://doi.org/10.1038/srep07802
