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Improving reuse of semiconductor equipment through benchmarking, standardization, and automation

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Author(s)
Silber, Jacob B. (Jacob Bradley)
Advisor(s)
Donald Rosenfield and David H. Marks.
Date Issued
2006
Publisher
Massachusetts Institute of Technology
Abstract
The 6D program at Intel® Corporation was set up to improve operations around capital equipment reuse, primarily in their semiconductor manufacturing facilities. The company was faced with a number of challenges, including differing work flows across multiple locations, lack of centralized work flow management, discontinuous inventory information, and other opportunities for cost reduction. The internship was set up to benchmark and explore potential for integration of best known methods, accumulated both inside and outside the company. Based on interviews, research and quantitative analysis, opportunities were identified for reuse of equipment shipping crates, improvement in warehouse inventory management, and changes in labor models to facilitate better knowledge capture and dissemination. As a result of this study Intel® Corporation may realize significant improvement in the areas mentioned in terms of cost reduction, process improvement and knowledge management. By using a flexible approach to problem identification and generating organizational interest in the improvements, recommendations were well received and should lead to eventual adoption.
Description
Thesis (M.B.A.)--Massachusetts Institute of Technology, Sloan School of Management; and, (S.M.)--Massachusetts Institute of Technology, Dept. of Civil and Environmental Engineering; in conjunction with the Leaders for Manufacturing Program at MIT, 2006.
Includes bibliographical references (p. 91-92).
Subjects
Sloan School of Management.
Civil and Environmental Engineering.
Leaders for Manufacturing Program.
MIT Department
Leaders for Manufacturing Program at MIT
Massachusetts Institute of Technology. Department of Civil and Environmental Engineering
Sloan School of Management
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M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.
http://dspace.mit.edu/handle/1721.1/7582
Persistent DSpace Link
http://hdl.handle.net/1721.1/37235
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