A modular laboratory curriculum for teaching integrated photonics to students with diverse backgrounds
Name
111431C.pdf
Description
Published version
Size
1.64 MB
Format
Adobe PDF
Checksum (MD5)
967a7661eed535c47d2ed3271158217a
Author(s)
Serna, Samuel
Hidalgo, Nancy
Tjan, Janice
McComber, Kevin
Kimerling, Lionel C
Verlage, Erik
Diop, Julie C
Hu, Juejun
Saini, Sajan
Agarwal, Anu
Date Issued
May 2019
Journal
Proceedings of SPIE--the Society of Photo-Optical Instrumentation Engineers
Publisher
SPIE
Citation
Serna, Samuel et al. “A modular laboratory curriculum for teaching integrated photonics to students with diverse backgrounds.” Paper presented at the Fifteenth Conference on Education and Training in Optics and Photonics: ETOP 2019, Quebec City, Quebec, 21-24 May 2019, SPIE, 111431C © 2019 The Author(s)
Version
Final published version
Abstract
A modular laboratory curriculum with exercises for students and lesson plans for teachers is presented. Fundamentals of basic integrated photonic (IP) devices can be taught, first as a lecture-in-the-lab followed by “hands-on” laboratory measurements. This comprehensive curriculum utilizes data collected from the “AIM Photonics Institute PIC education chip” that was designed specifically for the purpose of education, and was fabricated at AIM SUNY Poly. Training using this modular curriculum will be performed through the AIM Photonics Academy network in New York (NY) and Massachusetts (MA), either as a full semester course or as a condensed boot-camp. A synergistic development and delivery of this curriculum will coherently leverage multiple resources across the network and can serve as a model for education and workforce development in other Manufacturing USA institutes, as well as for overseas partners.
MIT Department
Massachusetts Institute of Technology. Department of Materials Science and Engineering
MIT Materials Research Laboratory
Lincoln Laboratory
Terms of Use
Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.
Persistent DSpace Link
DOI of Published Version
https://doi.org/10.1117/12.2523867
