Integration of reactive polymeric nanofilms into a low-power electromechanical switch for selective chemical sensing
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Arora-2009-Integration of reactive polymeric nanofilms into a low-power electromechanical .pdf
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Author(s)
Arora, William J.
Tenhaeff, Wyatt E.
Barbastathis, George
Gleason, Karen K
Date Issued
February 2009
Journal
Journal of Microelectromechanical Systems
Publisher
Institute of Electrical and Electronics Engineers
Citation
Arora, W.J. et al. “Integration of Reactive Polymeric Nanofilms Into a Low-Power Electromechanical Switch for Selective Chemical Sensing.” Microelectromechanical Systems, Journal of 18.1 (2009): 97-102. © Copyright 2009 IEEE
Version
Final published version
Abstract
This paper presents the fabrication and demonstration of an ultrathin microelectromechanical chemical sensing device. Microcantilevers are etched from 100-nm-thick silicon nitride, and a 75-nm-thick reactive copolymer film for sensing is deposited by initiated chemical vapor deposition. Cross-linking densities of the polymer films are controlled during the deposition process; it is shown that greater cross-linking densities yield greater cantilever deflections upon the polymer's reaction with the analyte. Considering that chemical reactions are necessary for stress formation, the sensing is selective. Cantilever deflections of greater than 3 à ¿m are easily attained, which allow a simple switch to be designed with resistance-based outputs. When exposed to a hexylamine vapor-phase concentration of 0.87 mol%, the resistance of the switch drops by over six orders of magnitude with a response time of less than 90 s.
Subjects
three-dimensional nanomanufacturing
three-dimensional nanomanufacturing
thin films
microsensors
Chemical–vapor deposition (CVD)
MIT Department
Massachusetts Institute of Technology. Institute for Soldier Nanotechnologies
Massachusetts Institute of Technology. Department of Chemical Engineering
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
Massachusetts Institute of Technology. Department of Mechanical Engineering
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Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.
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DOI of Published Version
https://doi.org/10.1109/JMEMS.2008.2008529
