A nonintrusive magnetically self-powered vibration sensor for automated condition monitoring of electromechanical machines
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Leeb_A nonintrusive.pdf
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Author(s)
Zachar, Lt. Ryan
Cotta, Lt. William
Schantz, Christopher
Moon, Jinyeong
Lindahl, Peter
Donnal, John Sebastian
Leeb, Steven B
Date Issued
October 2016
Journal
2016 IEEE AUTOTESTCON
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Citation
Moon, Jinyeong et al. “A Nonintrusive Magnetically Self-Powered Vibration Sensor for Automated Condition Monitoring of Electromechanical Machines.” 2016 IEEE AUTOTESTCON, September 12-15 2016, Anaheim, California, USA, Institute of Electrical and Electronics Engineers (IEEE), October 2016 © 2016 Institute of Electrical and Electronics Engineers (IEEE)
Version
Author's final manuscript
Abstract
This paper presents a nonintrusive and electromagnetically self-powered embedded system with vibration sensor for condition monitoring of electromechanical machinery. This system can be installed inside the terminal block of a motor or generator and supports wireless communication for transferring data to a mobile device or computer for subsequent performance analysis. As an initial application, the sensor package is configured for automated condition monitoring of resiliently mounted machines. Upon detecting a spin-down event, e.g. a motor turnoff, the system collects and transmits vibration and residual backemf data as the rotor decreases in rotational speed. This data is then processed to generate an empirical vibrational transfer function (eVTF) rich in condition information for detecting and differentiating machinery and vibrational mount pathologies. The utility of this system is demonstrated via lab-based tests of a resiliently mounted 1.1 kW three-phase induction motor, with results showcasing the usefulness of the embedded system for condition monitoring.
MIT Department
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
Massachusetts Institute of Technology. Department of Mechanical Engineering
Massachusetts Institute of Technology. Research Laboratory of Electronics
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DOI of Published Version
https://doi.org/10.1109/AUTEST.2016.7589635
