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Thermo-mechanical stress relief analysis in PMMA and 6000 series aluminum

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Author(s)
Stephens, Scott, S.B. (Scott A.). Massachusetts Institute of Technology
Advisor(s)
Thomas W. Eagar.
Alternative Title
Thermo-mechanical stress relief analysis in polymethyl methacrylate and 6000 series aluminum
Date Issued
2014
Publisher
Massachusetts Institute of Technology
Abstract
Stress relief of materials produced in bulk is a key part of the manufacturing process. The most common kinds are either thermal or mechanical and are commonly applied to commercial metal alloys. A third type, thermo-mechanical, utilizes thermal gradients to induce residual stresses of an equal and opposite nature to balance compressive and tensile stresses existing in the material after solutionizing. The experiment detailed in this work shows the effect of thermal gradients on residual stresses in polymethyl methacrylate (PMMA). A downhill quench from 95 C to 15C is able to create a deflection of 2.36 millimeters, evidence of residual stress. A subsequent uphill quench from -40 to 100 degrees reduced the deflection by 37 percent. The finite element simulation of a 6000 series aluminum block verifies that under properly controlled processing parameters, it is possible to induce opposite stresses to relieve residual stresses in a quenched material. Additional limitations to the uphill quench technique are detailed in the following work so that thermo-mechanical stress relief may be properly applied to a range of materials.
Description
Thesis: S.B., Massachusetts Institute of Technology, Department of Materials Science and Engineering, 2014.
Cataloged from PDF version of thesis.
Includes bibliographical references (page 32).
Subjects
Materials Science and Engineering.
MIT Department
Massachusetts Institute of Technology. Department of Materials Science and Engineering
Terms of Use
M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.
http://dspace.mit.edu/handle/1721.1/7582
Persistent DSpace Link
http://hdl.handle.net/1721.1/89983
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