Thermal fatigue of solder joints in micro-electronic devices
Name
15625969-MIT.pdf
Description
Full printable version
Size
8.11 MB
Format
Adobe PDF
Checksum (MD5)
1455c4535a1780f70751bbbf849e94e9
Author(s)
Adams, Pamela Joan
Advisor(s)
Lallit Anand.
Date Issued
1986
Publisher
Massachusetts Institute of Technology
Description
Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1986.
MICROFICHE COPY AVAILABLE IN ARCHIVES AND ENGINEERING
Bibliography: leaves 48-52.
Subjects
Mechanical Engineering.
MIT Department
Massachusetts Institute of Technology. Department of Mechanical Engineering
Terms of Use
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