Cleaning process development and optimization in the surface mount assembly line of power modules
Name
775602612-MIT.pdf
Description
Full printable version
Size
9.29 MB
Format
Adobe PDF
Checksum (MD5)
a8b1252d69fb7c6e98a8c2b5e9033ce8
Author(s)
Mukherjee, Ishan
Advisor(s)
Jung Hoon Chun.
Date Issued
2011
Publisher
Massachusetts Institute of Technology
Abstract
The cleaning process in the surface mount assembly line of power modules had been found to insufficiently remove solder flux residue from printed circuit board (PCB) assemblies after the process of reflow soldering. This thesis details the development of an optimized cleaning process that effectively removes solder flux residue from PCB assemblies. The first stage of this study involves the experimental validation of root cause of process ineffectiveness. A novel visual inspection based grading scale is developed to quantify the amount of residue present. Using the grading scale optimal process parameters were identified and studied. The study finds that power modules are most effectively cleaned in a saponifier based cleaning solution using ultrasonic agitation. Power modules are completely cleaned when washed in an ultrasonic bath at 60°C for 7 minutes, in a saponifier based cleaning solution that is 5% concentration by volume.
Description
Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2011.
Cataloged from PDF version of thesis.
Includes bibliographical references (p. 83-84).
Subjects
Mechanical Engineering.
MIT Department
Massachusetts Institute of Technology. Department of Mechanical Engineering
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