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  4. Minimally invasive electroceutical catheter for endoluminal defect sealing

Minimally invasive electroceutical catheter for endoluminal defect sealing

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sword-2022-01-12T18:04:20.original.xml (130 B)
Original SWORD entry document
Author(s)
Singh, Manisha
•
Varela, Claudia Elena
•
Whyte, William
•
Horvath, Markus A.
•
Tan, Nigel CS
•
Ong, Chee Bing
•
Liang, Patric
•
Schermerhorn, Marc L
•
Roche, Ellen
•
Steele, Terry WJ
Date Issued
2021
Journal
Science Advances
Publisher
American Association for the Advancement of Science (AAAS)
Citation
Singh, Manisha, Varela, Claudia E, Whyte, William, Horvath, Markus A, Tan, Nigel CS et al. 2021. "Minimally invasive electroceutical catheter for endoluminal defect sealing." Science Advances, 7 (14).
Version
Final published version
Abstract
Surgical repair of lumen defects is associated with periprocedural morbidity and mortality. Endovascular repair with tissue adhesives may reduce host tissue damage, but current bioadhesive designs do not support minimally invasive deployment. Voltage-activated tissue adhesives offer a new strategy for endoluminal repair. To facilitate the clinical translation of voltage-activated adhesives, an electroceutical patch (ePATCH) paired with a minimally invasive catheter with retractable electrodes (CATRE) is challenged against the repair of in vivo and ex vivo lumen defects. The ePATCH/CATRE platform demonstrates the sealing of lumen defects up to 2 millimeters in diameter on wet tissue substrates. Water-tight seals are flexible and resilient, withstanding over 20,000 physiological relevant stress/strain cycles. No disruption to electrical signals was observed when the ePATCH was electrically activated on the beating heart. The ePATCH/CATRE platform has diverse potential applications ranging from endovascular treatment of pseudo-aneurysms/fistulas to bioelectrodes toward electrophysiological mapping.
MIT Department
Massachusetts Institute of Technology. Institute for Medical Engineering & Science
Massachusetts Institute of Technology. Department of Mechanical Engineering
Terms of Use
Creative Commons Attribution NonCommercial License 4.0
https://creativecommons.org/licenses/by-nc/4.0/
Persistent DSpace Link
https://hdl.handle.net/1721.1/138896.2
DOI of Published Version
https://doi.org/10.1126/SCIADV.ABF6855
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