Mitigation of Thermal Stability Concerns in FinFET Devices
Name
electronics-11-03305-v3.pdf
Size
2.77 MB
Format
Adobe PDF
Checksum (MD5)
fb1c57483381460aa53c510790ff8c0a
Author(s)
Bender, Emmanuel
Bernstein, Joseph B.
Boning, Duane S.
Date Issued
October 14, 2022
Publisher
Multidisciplinary Digital Publishing Institute
Citation
Electronics 11 (20): 3305 (2022)
Version
Final published version
Abstract
Here, we developed a procedure for mitigating thermal hazards in packaged FinFET devices. A monitoring system was installed into devices, based on self-heating impact analysis in the system and device levels, to allow for the observation and alerting of chip temperature and reliability risks. A novel algorithm for reducing measurement noise by means of temperature fluctuation compensation and the filtering of invalid data is presented and demonstrated on packaged devices. The results presented in this work show that the proposed techniques make exceptional improvements to sensory accuracy. Using this methodology enables the mitigation of thermal concerns in systems, including large data servers, and accelerates development of smart resource allocation formations.
MIT Department
Massachusetts Institute of Technology. Microsystems Technology Laboratories
Terms of Use
Creative Commons Attribution
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DOI of Published Version
https://doi.org/10.3390/electronics11203305
