Underfill material selection for flip chip technology
Name
42075763-MIT.pdf
Description
Full printable version
Size
10.44 MB
Format
Adobe PDF
Checksum (MD5)
80dcf188fa45cb85afdffa45451fc146
Author(s)
Chiang, Diana C. (Diana Chih-Chan), 1975-
Advisor(s)
David K. Roylance.
Date Issued
1998
Publisher
Massachusetts Institute of Technology
Abstract
Six underfill materials were examined for the selection of an appropriate underfill material for Digital Equipment Corporation's flip chip development project. Several tests were performed to determine the material properties, process properties, and the reliability of each underfill material. A material with a fast flow rate, uniform and void free flow pattern, fast curing schedule, good thermal and mechanical properties, and good reliability results is needed to satisfy the requirements for this project. Materials F and E exhibited all the above requirements and were concluded as the two best underfill materials for the flip chip process. Important material properties which contributed to the desired results of these materials include a filler particle content of about 65%, a weight loss percentage during cure of less than 1%, and a Tg of 140°C.
Description
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1998.
Includes bibliographical references (leaf 34).
Subjects
Materials Science and Engineering
MIT Department
Massachusetts Institute of Technology. Department of Materials Science and Engineering
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