Fits like a Flex-Glove: Automatic Design of Personalized FPCB-Based Tactile Sensing Gloves
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3706599.3720147.pdf
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104.12 MB
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Adobe PDF
Checksum (MD5)
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Author(s)
Murphy, Devin
Li, Yichen
Owens, Crystal
Stanton, Layla
Liang, Paul Pu
Luo, Yiyue
Torralba, Antonio
Matusik, Wojciech
Date Issued
April 25, 2025
Publisher
ACM|Extended Abstracts of the CHI Conference on Human Factors in Computing Systems
Citation
Devin Murphy, Yichen Li, Crystal Elaine Owens, Layla Stanton, Paul Pu Liang, Yiyue Luo, Antonio Torralba, and Wojciech Matusik. 2025. Fits like a Flex-Glove: Automatic Design of Personalized FPCB-Based Tactile Sensing Gloves. In Proceedings of the Extended Abstracts of the CHI Conference on Human Factors in Computing Systems (CHI EA '25). Association for Computing Machinery, New York, NY, USA, Article 280, 1–8.
Version
Final published version
Abstract
Resistive tactile sensing gloves have captured the interest of researchers spanning diverse domains, such as robotics, healthcare, and human-computer interaction. However, existing fabrication methods often require labor-intensive assembly or costly equipment, limiting accessibility. Leveraging flexible printed circuit board (FPCB) technology, we present an automated pipeline for generating resistive tactile sensing glove design files solely from a simple hand photo on legal-size paper, which can be readily supplied to commercial board houses for manufacturing. Our method enables cost-effective, accessible production at under $130 per glove with sensor assembly times under 15 minutes. Sensor performance was characterized under varying pressure loads, and a preliminary user evaluation showcases four unique automatically manufactured designs, evaluated for their reliability and comfort.
Description
CHI EA ’25, Yokohama, Japan
MIT Department
Massachusetts Institute of Technology. Computer Science and Artificial Intelligence Laboratory
Massachusetts Institute of Technology. Department of Architecture
Massachusetts Institute of Technology. Media Laboratory
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
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Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.
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DOI of Published Version
https://doi.org/10.1145/3706599.3720147
