Repository logo
Log in(current)
Repository logoMIT Open ScholarshipDSpace@MIT
  1. Home
  2. MIT Libraries
  3. MIT Theses
  4. Doctoral Theses
  5. Microstructural modification of thin films and its relation to the electromigration-limited reliability of VLSI interconnects

Microstructural modification of thin films and its relation to the electromigration-limited reliability of VLSI interconnects

Thumbnail Image
Download
Name

26408909-MIT.pdf

Description
Full printable version
Size

18.22 MB

Format

Adobe PDF

Checksum (MD5)

dfb01f6b474b1b805c3bbbd389329bcc

Author(s)
Longworth, Hai Pham
Advisor(s)
Carl V. Thompson.
Date Issued
1992
Publisher
Massachusetts Institute of Technology
Description
Thesis (Sc. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1992.
Includes bibliographical references (leaves 246-262).
Subjects
Materials Science and Engineering
MIT Department
Massachusetts Institute of Technology. Department of Materials Science and Engineering
Terms of Use
M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.
http://dspace.mit.edu/handle/1721.1/7582
Persistent DSpace Link
http://hdl.handle.net/1721.1/13114
Repository logo
PrivacyPermissionsAccessibilityContact us
Repository logo
Notify us about copyright concerns.