Effects of thermal cycling on epoxy bonded materials
Name
775674464-MIT.pdf
Description
Full printable version
Size
1.16 MB
Format
Adobe PDF
Checksum (MD5)
e167ad878c54215eeadc2fa9ff1ed7af
Author(s)
Burroughs, Michelle (Michelle L.)
Advisor(s)
Paulo Lozano.
Date Issued
2011
Publisher
Massachusetts Institute of Technology
Abstract
Thermal cycling is a concern to those who use epoxy as an adhesion in space applications due to the mechanical and thermal properties of both the epoxy and adhered materials. These properties include the thermal expansion coefficient, a, and the stress at which the epoxy will yield fracture. An experiment was carried out to find out if failure would occur by thermal cycling of epoxy bonded components in the propulsion components of a small satellite. Failure did not occur due to shear stress attributed to the thermal expansion coefficient but unexpectedly to the liquefaction of epoxy in 3 of the 6 samples. The samples with thicker epoxy layers failed in contrast to the thinner epoxy layer samples. Overall, thermal cycling is still a concern for failure of the epoxy bond.
Description
Thesis (S.B.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2011.
Cataloged from PDF version of thesis.
Includes bibliographical references (p. 21-22).
Subjects
Mechanical Engineering.
MIT Department
Massachusetts Institute of Technology. Department of Mechanical Engineering
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copyright. They may be viewed from this source for any purpose, but
reproduction or distribution in any format is prohibited without written
permission. See provided URL for inquiries about permission.
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