Infrared vertically-illuminated photodiode for chip alignment feedback
Name
1.4961949.pdf
Description
Published version
Size
5.33 MB
Format
Adobe PDF
Checksum (MD5)
e6d198f74a20ec48072e471af3b1f87c
Author(s)
Alloatti, Luca
Ram, Rajeev J
Date Issued
August 2016
Journal
Methods
Publisher
AIP Publishing
Citation
Alloatti, L., and R. J. Ram. “Infrared Vertically-Illuminated Photodiode for Chip Alignment Feedback.” AIP Advances 6, 8 (August 2016): 085219. © 2016 the Authors
Version
Final published version
Abstract
We report on vertically-illuminated photodiodes fabricated in the GlobalFoundries 45nm 12SOI node and on a packaging concept for optically-interconnected chips. The photodiodes are responsive at 1180 nm -a wavelength currently used in chip-to-chip communications. They have further a wide field-of-view which enables chip-to-board positional feedback in chip-board assemblies. Monolithic integration enables on-chip processing of the positional data.
MIT Department
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
Massachusetts Institute of Technology. Research Laboratory of Electronics
Terms of Use
Creative Commons Attribution 4.0 International license
Persistent DSpace Link
DOI of Published Version
https://doi.org/10.1063/1.4961949
