Soft nanocomposite electroadhesives for digital micro- and nanotransfer printing
Name
eaax4790.full.pdf
Description
Published version
Size
1.95 MB
Format
Adobe PDF
Checksum (MD5)
cb7bce415eda7b0592d53853c8dfffda
Author(s)
Kim, Sanha
Boutilier, Michael Stephen Hatcher
Nayakanti, Nigamaa
Cao, Changhong
Jacob, Christine
Zhao, Hangbo
Hart, Anastasios John
Date Issued
October 2019
Journal
Science advances
Publisher
American Association for the Advancement of Science (AAAS)
Citation
Kim, Sanha et al. "Soft nanocomposite electroadhesives for digital micro- and nanotransfer printing." Science advances 5 (2019): eaax4790 © 2019 The Author(s)
Version
Final published version
Abstract
Automated handling of microscale objects is essential for manufacturing of next-generation electronic systems. Yet, mechanical pick-and-place technologies cannot manipulate smaller objects whose surface forces dominate over gravity, and emerging microtransfer printing methods require multidirectional motion, heating, and/or chemical bonding to switch adhesion. We introduce soft nanocomposite electroadhesives (SNEs), comprising sparse forests of dielectric-coated carbon nanotubes (CNTs), which have electrostatically switchable dry adhesion. SNEs exhibit 40-fold lower nominal dry adhesion than typical solids, yet their adhesion is increased >100-fold by applying 30 V to the CNTs. We characterize the scaling of adhesion with surface morphology, dielectric thickness, and applied voltage and demonstrate digital transfer printing of films of Ag nanowires, polymer and metal microparticles, and unpackaged light-emitting diodes.
MIT Department
Massachusetts Institute of Technology. Department of Mechanical Engineering
Terms of Use
Creative Commons Attribution NonCommercial License 4.0
Persistent DSpace Link
DOI of Published Version
https://doi.org/10.1126/sciadv.aax4790
