Low temperature transient liquid phase bonding for electronic packaging
Name
27659862-MIT.pdf
Description
Full printable version
Size
3.63 MB
Format
Adobe PDF
Checksum (MD5)
7e0d1ef20432bc893c2d98c2fdcb42d3
Author(s)
Hou, Michelle M. (Michelle Ming-Jan)
Advisor(s)
Thomas W. Eagar.
Date Issued
1992
Publisher
Massachusetts Institute of Technology
Description
Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1992.
Includes bibliographical references (leaf 50)
Subjects
Materials Science and Engineering
MIT Department
Massachusetts Institute of Technology. Department of Materials Science and Engineering
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