Review of Direct Metal Bonding for Microelectronic Interconnections
Name
AMMNS018.pdf
Size
335.13 KB
Format
Adobe PDF
Checksum (MD5)
8533fae9b743de8f4a0a500d031a7b76
Author(s)
Zhang, G.G.
Wong, Chee Cheong
Date Issued
January 2004
Series/Report no.
Advanced Materials for Micro- and Nano-Systems (AMMNS);
Abstract
Microelectronic interconnections require advanced joining techniques. Direct metal bonding methods, which include thercomsonic and thermocompression bonding, offer remarkable advantages over soldering and adhesives joining. These processes are reviewed in this paper. The progress made in this area is outlined. Some work concerned with the bonding modeling is also presented. This model is based on the joint interface mechanics resulting from compression. Both bump and substrate deformation are taken into account. The improved understanding of the relationship between the deformation and bonding formation may provide more accurate joint evaluation criterion.
Subjects
direct metal bonding
microelectronic interconnections
bump deformation
substrate deformation
thermosonic bonding
compression modeling
thermocompression bonding
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