Bundled Gradients Through Contact Via Randomized Smoothing
Name
2103.08710.pdf
Description
Accepted version
Size
8.3 MB
Format
Adobe PDF
Checksum (MD5)
b85c4b3a73abdf9c27e09a6555517198
Author(s)
Suh, Hyung Ju Terry
Pang, Tao
Tedrake, Russ
Date Issued
2022
Journal
IEEE Robotics and Automation Letters
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Citation
Suh, Hyung Ju Terry, Pang, Tao and Tedrake, Russ. 2022. "Bundled Gradients Through Contact Via Randomized Smoothing." IEEE Robotics and Automation Letters, 7 (2).
Version
Author's final manuscript
MIT Department
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
Massachusetts Institute of Technology. Computer Science and Artificial Intelligence Laboratory
Terms of Use
Creative Commons Attribution-Noncommercial-Share Alike
Persistent DSpace Link
DOI of Published Version
https://doi.org/10.1109/LRA.2022.3146931
