Real time process monitoring of solder paste stencil printing

Braunstein, Daniel J. (Daniel Judah)

Real time process monitoring of solder paste stencil printing

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30822279-MIT.pdf

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2.72 MB

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Author(s)

Braunstein, Daniel J. (Daniel Judah)

Advisor(s)

Haruhiko Asada.

Date Issued

1994

Publisher

Massachusetts Institute of Technology

Description

Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1994.

Includes bibliographical references (leaves 61-64).

Subjects

Mechanical Engineering

MIT Department

Massachusetts Institute of Technology. Department of Mechanical Engineering

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M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.

http://dspace.mit.edu/handle/1721.1/7582

Persistent DSpace Link

http://hdl.handle.net/1721.1/35374