Micromechanics of deformation and stress evolution in thin films and patterned lines on substrates
Name
48172017-MIT.pdf
Description
Full printable version
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11.8 MB
Format
Adobe PDF
Checksum (MD5)
d3790e4f42520b4868e1fcac2f3d97df
Author(s)
Gouldstone, Andrew
Advisor(s)
Subra Suresh.
Date Issued
2001
Publisher
Massachusetts Institute of Technology
Abstract
In this thesis, we investigated the mechanical behavior of small volume structures, with specific application to thin metal films and patterned metal lines on substrates. The first part of this investigation dealt with the elastoplastic behavior of interconnect lines during thermal cycling. A robust computational method was developed to predict volume-averaged stresses in unpassivated and passivated lines in response to changes in temperature, as a function of line geometry, material properties and thermal history. The computational model also facilitated the extraction of substrate curvature. In addition, a simple analytical method was developed to allow extraction of volume-averaged stresses in unpassivated lines upon yielding due to thermal stresses, via experimental curvature methods. The second part of the investigation involved the systematic nanoindentation of a wide range of FCC single crystals and polycrystals, in bulk and thin film form. For shallow (
Description
Thesis (Ph.D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2001.
Includes bibliographical references (p. 123-129).
Subjects
Materials Science and Engineering.
MIT Department
Massachusetts Institute of Technology. Department of Materials Science and Engineering
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