Active Thermal Control of Distributed Parameter Systems Excited at MultipleFrequencies
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lrichter04.pdf
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Author(s)
Richter, Christoph
C.
Lienhard, John H
Date Issued
February 10, 2005
Journal
ASME Journal of Heat Transfer
Publisher
ASME International
Citation
Richter, C., and Lienhard, J. H., V (February 10, 2005). "Active Thermal Control of Distributed Parameter Systems Excited at Multiple Frequencies." ASME. J. Heat Transfer. January 2006; 128(1): 93–99.
Version
Author's final manuscript
Abstract
In testing packaged high-power integrated circuits, active thermal control is useful in providing die-level temperature stability. A time-varying heat load is applied to the surface of the package to compensate for the time-varying test power sequence applied to the die. An earlier study determined the proper control heat load for a single-frequency sinusoidal variation in die power subject to a finite allowed temperature variation on the die. Actual test power sequences contain many frequencies at various phase angles, each contributing to the temperature variation of the die. In the present study, we develop a method of controlling multiple frequency test sequences subject to a finite temperature tolerance. It is shown that the total control power may be minimized assigning temperature tolerances to the highest frequencies in the test power sequence.
MIT Department
Massachusetts Institute of Technology. Department of Mechanical Engineering
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Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.
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DOI of Published Version
https://doi.org/10.1115/1.2130408
