Polytope Sector-Based Synthesis and Analysis of Microstructural Architectures With Tunable Thermal Conductivity and Expansion
Name
Fang_Polytope sector-based.pdf
Size
4.6 MB
Format
Adobe PDF
Checksum (MD5)
520aff4d9b058d8c5f2d45d57885ea22
Author(s)
Hopkins, Jonathan B.
Song, Yuanping
Lee, Howon
Spadaccini, Christopher M.
Fang, Xuanlai
Date Issued
March 2016
Journal
Journal of Mechanical Design
Publisher
ASME International
Citation
Hopkins, Jonathan B. et al. “Polytope Sector-Based Synthesis and Analysis of Microstructural Architectures With Tunable Thermal Conductivity and Expansion.” Journal of Mechanical Design 138.5 (2016): 051401. © 2016 ASME
Version
Final published version
Abstract
The aim of this paper is to (1) introduce an approach, called polytope sector-based synthesis (PSS), for synthesizing 2D or 3D microstructural architectures that exhibit a desired bulk-property directionality (e.g., isotropic, cubic, orthotropic, etc.), and (2) provide general analytical methods that can be used to rapidly optimize the geometric parameters of these architectures such that they achieve a desired combination of bulk thermal conductivity and thermal expansion properties. Although the methods introduced can be applied to general beam-based microstructural architectures, we demonstrate their utility in the context of an architecture that can be tuned to achieve a large range of extreme thermal expansion coefficients—positive, zero, and negative. The material-property-combination region that can be achieved by this architecture is determined within an Ashby-material-property plot of thermal expansion versus thermal conductivity using the analytical methods introduced. These methods are verified using finite-element analysis (FEA) and both 2D and 3D versions of the design have been fabricated using projection microstereolithography.
MIT Department
Massachusetts Institute of Technology. Department of Mechanical Engineering
Terms of Use
Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.
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DOI of Published Version
https://doi.org/10.1115/1.4032809
