Guest Editorial for Special Issue on High-Performance Multichip Interconnections
Name
Stojanovic-2010-Guest Editorial for Special Issue on High-Performance Multichip Interconnections.pdf
Size
109.65 KB
Format
Adobe PDF
Checksum (MD5)
aa74d214fb44289b109cd53966efda3a
Author(s)
Stojanovic, Vladimir Marko
Yang, Chih-Kong Ken
Ho, Ron
Date Issued
May 2010
Journal
IEEE Transactions on Circuits and Systems II: Express Briefs
Publisher
Institute of Electrical and Electronics Engineers
Citation
Stojanovic, V. M., C.-K. K. Yang, and R. Ho. “Guest Editorial for Special Issue on High-Performance Multichip Interconnections.” Circuits and Systems II: Express Briefs, IEEE Transactions on 57.5 (2010): 317-318. © Copyright 2010 IEEE
Version
Final published version
Abstract
The ten papers in this special issue focus on high-performance multichip interconnections. The papers span novel transmitter and receiver equalization and data-recovery architectures, channel architecture organizations, comparisons with optical transmission techniques, advanced signal processing and coding concepts, and network optimization.
MIT Department
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
Terms of Use
Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.
Persistent DSpace Link
DOI of Published Version
https://doi.org/10.1109/tcsii.2010.2048057
