Hierarchically structured surfaces for boiling critical heat flux enhancement
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2013_APL_Chu_Joung.pdf
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Author(s)
Enright, Ryan
Chu, Kuang-Han
Joung, Young soo
Buie, Cullen
Wang, Evelyn
Date Issued
April 2013
Journal
Applied Physics Letters
Publisher
American Institute of Physics (AIP)
Citation
Chu, Kuang-Han et al. “Hierarchically Structured Surfaces for Boiling Critical Heat Flux Enhancement.” Applied Physics Letters 102, 15 (April 2013): 151602 © 2013 AIP Publishing
Version
Final published version
Abstract
We report large enhancements in critical heat flux (CHF) on hierarchically structured surfaces, fabricated using electrophoretic deposition of silica nanoparticles on microstructured silicon and electroplated copper microstructures covered with copper oxide (CuO) nanostructures. A critical heat flux of ≈250 W/cm² was achieved on a CuO hierarchical surface with a roughness factor of 13.3, and good agreement between the model proposed in our recent study and the current data was found. These results highlight the important role of roughness using structures at multiple length scales for CHF enhancement. This high heat removal capability promises an opportunity for high flux thermal management.
MIT Department
Massachusetts Institute of Technology. Department of Mechanical Engineering
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Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.
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DOI of Published Version
https://doi.org/10.1063/1.4801811
